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World leading thermal resistance performance of 0.09°C/W. |
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| - Patented VGF (Vortex generator flow) technology to greatly increase air convection. |
| - Patented SEF (Stack Effect) design to enhance heat transfer. |
| - Unique air path creating high VEF (Vacuum Effect) to optimize the airflow. |
| - Patented HDT (Heat Pipe Direct Touch) Technology to ensure rapid thermal conduction and eliminate CPU hotspot. |
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Side flow type with four Ø6mm high performance heat pipes. |
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Unique T.B.Silence PWM fan to adjust the power efficiently and keep the silence. |
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Dual fan installed option and solid springs attached. |
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Anti-vibration rubbers prevent fan vibration and absorb noise. |
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Universal bracket for Intel® 775/1150/1155/1156/1366/2011 and AMD® AM2/AM2+/AM3/AM3+/FM1/FM2. |
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High thermal conductivity grease to ensure the best thermal conduction between CPU and the heat sink. |
