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Product > Cooler > CPU Cooler > ETD-T60-VD
Product Information
 
ETD-T60-VD
 
 
Feature
 
Leading thermal resistance performance 0.12 °C/W.
 
- Patented VGF (Vortex Generator Flow) technology to greatly increase air convection.
- Unique air path creating high VEF (Vacuum Effect Flow) to optimize the airflow.
- Each heat pipes soldered to the fins and bases for a definite contact in producing high efficiency rate of heat transfer.
Down flow design to cool CPU and its surrounding devices such as MOSFET and North bridged chipset.
Six Ø6mm heat pipes crossed from two sides of the heat sink to greatly improve cooling performance.
Nickel-plated heat pipes to reduce oxidation effect and maintain the top performance for long-term usage.
Patented universal brackets.
 
- Support Intel® LGA 775/1150/1155/1156/1366, AMD® AM2/AM2+/AM3/ AM3+/FM1/FM2.
- Apply AAP (Auto-Adjustable-Pressure) design giving perfect contact force (18~28kgw) between CPU and cooler.
Patented circular LED lights and fancy fan cover for the utmost eye-catching.
Unique T.B.Silence with PWM fan to adjust the power efficiently.
Anti-vibration rubbers prevent fan vibration and absorb noise.
High thermal conductivity grease to ensure the best thermal conduction between CPU and the heat sink.
 
 
 
 
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