Maximum compatibility
Compact size structure gives users greater flexibility in selecting chassis
Patented VGF (Vortex Generator Flow) to increase air convection around the heat pipes
Unique air path creating high VEF (Vacuum Effect) to optimize the airflow
HDT (Heat-pipe Direct Touch) technology ensures rapid thermal conduction and eliminates CPU hot spots quickly
Asymmetric heat pipe design allows extra space for perfect RAM compatibility
Tool-free mounting system ensures an effortless and easy installation
