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Maximum compatibility
Compact size structure gives users greater flexibility in selecting chassis
Patented VGF (Vortex Generator Flow) to increase air convection around the heat pipes
![](/archive/products/item/AirCooler/ETS-N31/ETS-N31-02.png)
Unique air path creating high VEF (Vacuum Effect) to optimize the airflow
![](/archive/products/item/AirCooler/ETS-N31/ETS-N31-03.png)
HDT (Heat-pipe Direct Touch) technology ensures rapid thermal conduction and eliminates CPU hot spots quickly
![](/archive/products/item/AirCooler/ETS-N31/ETS-N31-04.png)
![](/archive/products/item/AirCooler/ETS-N31/ETS-N31-05.png)
Asymmetric heat pipe design allows extra space for perfect RAM compatibility
Tool-free mounting system ensures an effortless and easy installation
![](/archive/products/item/AirCooler/ETS-N31/ETS-N31-06.png)
![](/archive/products/item/AirCooler/ETS-N31/ETS-N31-07.png)